MPi Canteliver Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is broadly applied on gold bump and pad wafer screening for display driver, logic, and memory unit. MPI’s cantilever probes would be the corresponding remedy to the demands of fi­ne pitch, tiny pad measurement, significant velocity, significantly less cleaning, multi-DUT, substantial pin rely, and extremely-small leakage requirements. With exceptional craftsmanship, ground breaking architecture and proven methodologies according to mechanical and electrical simulation/measurement outcomes, producing MPI the very best cantilever supplier around the world.


FCB Probe Card

The FCB Probe Card is considered the most experienced technological innovation of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and value of examination (COT) desire. FCB is often a demonstrated Option for several different semiconductor generation assessments from early engineering pilot-runs to higher quantity producing (HVM). FCB is prepared for machine necessitating large sign integrity probing (SI) and/or ability integrity probing (PI). Purposes include things like reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and even more. FCB guarantees the whole world’s finest All round cost-of-possession (COO) for different DUT applications.


EVS Probe Card

The EVS Probe Card is really an enhancement around the traditional buckling beam probe card. Important options are increased present carrying potential (C.C.C.) and reduced well balanced Get hold of force (BCF), and All round MEMS-like characteristics. EVS can easily fulfill the prerequisite of advanced wafer probing. Exact alignment and excellent planarity Management would be the critical elements contributing to steady contact resistance. With its capability and general performance, EVS Probe Card is a perfect option for advanced probe cards.


Osprey probe card

The Osprey probe card is MPI’s Option to demand for ever finer pitch. It truly is suitable for smaller Al pad, and is also perfect for very small pitch software with peripheral and complete array pattern. With exact alignment and greater planarity Command, Osprey can arrive at greater productiveness by multi-DUT style and design.  The forming wire (FW) style needle created with MPI’s very own micro fabrication course of action don't just provides superior-high quality efficiency but in addition makes it possible for uncomplicated needle substitution and shortens maintaining cycle time.



Kestrel Probe Card

The Kestrel Probe Card is equipped with MEMS wire (MW) needle which is designed for the demand of low force probing. It also comes with a chance to fulfill significant C.C.C. and significant pin counts application. The MEMS method guarantees very steady needle traits, and also the Particular composition layout allows precise alignment and planarity Management.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s read more comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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